Establishing the critical fracture properties of the die backside-to-molding compound interface-Reference-Cited by-同舟云学术

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Establishing the critical fracture properties of the die backside-to-molding compound interface

Published:2011-05 Issue: Volume: Page:
ISSN:
Container-title:2011 IEEE 61st Electronic Components and Technology Conference (ECTC)
language:
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Author:

Schlottig G.¹,Pape H.²,Wunderle B.³,Ernst L. J.¹

Affiliation:

1. Delft University of Technology, Mekelweg 2, 2628 CD Delft, the Netherlands

2. Infineon Technologies AG, Am Campeon 1-12, 85579 Neubiberg, Germany

3. Fraunhofer Institute Reliability and Microintegration IZM, Volmerstr. 9 b, 12489 Berlin, Germany

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/5871442/5898472/05898646.pdf?arnumber=5898646

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Neural networks for enhanced stress prognostics for encapsulated electronic packages - A comparison;Microelectronics Reliability;2021-08

2. Stress Prognostics for Encapsulated Standard Packages by Neural Networks Using Data from in-situ Condition Monitoring during Thermal Shock Tests;2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2020-07

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