Establishing the critical fracture properties of the die backside-to-molding compound interface

Author:

Schlottig G.1,Pape H.2,Wunderle B.3,Ernst L. J.1

Affiliation:

1. Delft University of Technology, Mekelweg 2, 2628 CD Delft, the Netherlands

2. Infineon Technologies AG, Am Campeon 1-12, 85579 Neubiberg, Germany

3. Fraunhofer Institute Reliability and Microintegration IZM, Volmerstr. 9 b, 12489 Berlin, Germany

Publisher

IEEE

Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Neural networks for enhanced stress prognostics for encapsulated electronic packages - A comparison;Microelectronics Reliability;2021-08

2. Stress Prognostics for Encapsulated Standard Packages by Neural Networks Using Data from in-situ Condition Monitoring during Thermal Shock Tests;2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2020-07

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