Author:
Majd Mehryar,Meszmer Peter,Priscaru Alexandru,Gromala Przemyslaw Jakub,Wunderle Bernhard
Cited by
3 articles.
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1. AI-assisted Design for Reliability: Review and Perspectives;2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2024-04-07
2. Large-Scale $$\mathscr {H}_2$$ Optimization for Thermo-Mechanical Reliability of Electronics;Mathematics in Industry;2024
3. Data Augmentation for Improved Stress Prognostics for Encapsulated Standard Packages by Neural Networks Using Data from in-situ Condition Monitoring during Thermal Shock Tests;2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2022-04-25