Data Augmentation for Improved Stress Prognostics for Encapsulated Standard Packages by Neural Networks Using Data from in-situ Condition Monitoring during Thermal Shock Tests-Reference-Cited by-同舟云学术

Data Augmentation for Improved Stress Prognostics for Encapsulated Standard Packages by Neural Networks Using Data from in-situ Condition Monitoring during Thermal Shock Tests

Published:2022-04-25 Issue: Volume: Page:
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Container-title:2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
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Author:

Meszmer Peter¹,Prisacaru Alexandru²,Gromala Przemyslaw Jakub³,Wunderle Bernhard¹

Affiliation:

1. Chemnitz University of Technology,Faculty for Electrical Engineering and Information Technologies, Chair Materials and Reliability of Microsystems,Chemnitz,Germany,09107

2. Simulation and WIP-Flow Optimization - Semiconductor Operations (RtP1/MFD2-SCO),Robert Bosch GmbH, Manufacturing Digitalization - AI-Solutions,Reutlingen,Germany,72703

3. Automotive Electronics, Engineering Product Owner Product Line 1 BRM (AE/ECH-PL1),Robert Bosch GmbH,Reutlingen,Germany,72703

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9758836/9758837/09758844.pdf?arnumber=9758844

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