Author:
Meszmer Peter,Majd Mehryar,Prisacaru Alexandru,Gromala Przemyslaw Jakub,Wunderle Bernhard
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference41 articles.
1. Prognostics and health monitoring of electronic system: a review;Prisacaru,2017
2. Thermo-mechanical reliability during technology development of power chip-on-board assemblies with encapsulation;Wunderle;Microsyst. Technol.,2009
3. Lifetime modeling for microsystems integration - from nano to systems;Wunderle;J. Microsyst. Technol.,2009
4. An in-situ numerical-experimental approach for fatigue delamination characterization in microelectronic packages;Poshtan,2015
5. Schlottig, G., Pape, H., Wunderle, B. & Ernst, L. J. Establishing the critical fracture properties of the die backside-to-molding compound interface. In 2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 1090–1096 (2011). DOI https://doi.org/10.1109/ECTC.2011.5898646.
Cited by
8 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Heterogeneous and hybrid integration system in display technology;Moore and More;2024-05-28
2. AI-assisted Design for Reliability: Review and Perspectives;2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2024-04-07
3. MachNet, a general Deep Learning architecture for Predictive Maintenance within the industry 4.0 paradigm;Engineering Applications of Artificial Intelligence;2024-01
4. Artificial intelligence aided design for heterogeneous integration system in display;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05
5. AI surrogate models for error analysis in optical systems;2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2023-04-17