Modeling, design and demonstration of ultra-miniaturized glass PA modules with efficient thermal dissipation-Reference-Cited by-同舟云学术

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Modeling, design and demonstration of ultra-miniaturized glass PA modules with efficient thermal dissipation

Published:2015-05 Issue: Volume: Page:
ISSN:
Container-title:2015 IEEE 65th Electronic Components and Technology Conference (ECTC)
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Author:

Kim Min Suk,Cho Sangbeom,Min Junki,Pulugurtha Markondeya Raj,Huang Nathan,Sitaraman Srikrishna,Sundaram Venky,Velez Mario,Ravindran Arjun,Joshi Yogendra,Tummala Rao

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/7133058/7159553/07159742.pdf?arnumber=7159742

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Impact of Through Glass Vias Filling on the Performance of Passive Thermal Cooling in Photonic Packages;2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC);2022-09-13

2. Characterization of Alumina Ribbon Ceramic Substrates for 5G and mm-Wave Applications;IEEE Transactions on Components, Packaging and Manufacturing Technology;2022-09

3. Electrothermal Characterization, TCAD Simulations, and Physical Modeling of Advanced SiGe HBTs;Nanoelectronics;2019

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