Impact of Through Glass Vias Filling on the Performance of Passive Thermal Cooling in Photonic Packages-Reference-Cited by-同舟云学术

Impact of Through Glass Vias Filling on the Performance of Passive Thermal Cooling in Photonic Packages

Published:2022-09-13 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)
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Author:

Gupta Parnika¹,Morrissey Padraic E.¹,O' Brien Peter¹,Krohnert Kevin²,Wohrmann Markus²,Schiffer Michael²,Kelb Christian³,Ambrosius Norbert³,Schneider-Ramelow Martin⁴

Affiliation:

1. Tyndall National Institute,Cork,Ireland

2. Wafer Level System Integration Fraunhofer IZM,Berlin,Germany

3. LPKF Laser & Electronics AG,Garbsen,Germany

4. Technical University Berlin,Berlin,Germany

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9939139/9939378/09939531.pdf?arnumber=9939531

Reference9 articles.

1. Impact of Copper Through-Package Vias on Thermal Performance of Glass Interposers

2. Thermal challenges for packaging integrated photonic devices

3. Process-based cost modeling of photonics manufacture: the cost competitiveness of monolithic integration of a 1550-nm DFB laser and an electroabsorptive modulator on an InP platform

4. Modeling, design and demonstration of ultra-miniaturized glass PA modules with efficient thermal dissipation

5. High-throughput via formation in solid-core glass for ic substrates;ostholt;MINAPAD Conference,2017

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