Effects of cleaning process on the reliability of ultra-fine gap for 3D package-Reference-Cited by-同舟云学术

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Effects of cleaning process on the reliability of ultra-fine gap for 3D package

Published:2015-05 Issue: Volume: Page:
ISSN:
Container-title:2015 IEEE 65th Electronic Components and Technology Conference (ECTC)
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Author:

Chan Mu-Hsuan,Hsue Brock,Lin Chun-Tang,Chiu Steve,Wang Yu-Po

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/7133058/7159553/07159746.pdf?arnumber=7159746

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Development of Fluxless Micro-Bonding and Narrow Gap Filling Process;Journal of The Japan Institute of Electronics Packaging;2024-08-01

2. A Study on Improvement and Extension of Fine-Pitch Micro-Bump Interconnects Technology: New Metallurgy & Flux-Less Oxide-removal Laser Assembly (FLOLA);2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

3. Development of Fluxless Micro-Bonding and Narrow Gap Filling Process;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

4. Bond At The End: A Comprehensive Study of a New High-Throughput Bonding Process;2020 IEEE 70th Electronic Components and Technology Conference (ECTC);2020-06

5. The Development and Technological Comparison of Various Die Stacking and Integration Options with TSV Si Interposer;2016 IEEE 66th Electronic Components and Technology Conference (ECTC);2016-05

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