Demonstration of High Electrical Reliability of Sub-2 Micron Cu Traces Covered with Inorganic Dielectrics for Advanced Packaging Technologies-Reference-Cited by-同舟云学术

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Demonstration of High Electrical Reliability of Sub-2 Micron Cu Traces Covered with Inorganic Dielectrics for Advanced Packaging Technologies

Published:2017-05 Issue: Volume: Page:
ISSN:
Container-title:2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
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Author:

Kudo Hiroshi,Kasai Ryohei,Suyama Jyunichi,Takeda Mitsuhiro,Okazaki Yumi,Iida Haruo,Kitayama Daisuke,Sasao Toshio,Sakamoto Kouji,Sato Hiroaki,Yamada Shouhei,Kuramochi Satoru

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/7998598/7999654/07999933.pdf?arnumber=7999933

Cited by 20 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Fabrication of Two-Types Panel-Level Interposers with Fine Cu Wirings and Outstanding Electrical Reliability;Journal of The Japan Institute of Electronics Packaging;2024-08-01

2. Advanced FO-PLP with Multi-chip for Wearable Application;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

3. Enhanced Biased HAST Reliability of Polyimide for High-Density Redistribution Layers;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

4. Experimental study of transmission signal performance of sub-2 micron fine-wiring with novel structure;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

5. A Review of Polymer Dielectrics for Redistribution Layers in Interposers and Package Substrates;Polymers;2023-09-26

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