Experimental study of transmission signal performance of sub-2 micron fine-wiring with novel structure
Author:
Affiliation:
1. Dai Nippon Printing Co. Ltd.,Kashiwa-Shi,Japan
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx8/10564841/10564831/10564974.pdf?arnumber=10564974
Reference8 articles.
1. Heterogeneous Integration of Optical Interconnects
2. Panel-Based Large-Scale RDL Interposer Fabricated Using 2-μm-Pitch Semi-Additive Process for Chiplet-Based Integration
3. Demonstration of High Electrical Reliability of Sub-2 Micron Cu Traces Covered with Inorganic Dielectrics for Advanced Packaging Technologies
4. Effectiveness of Inorganic Dielectric Layer on Submicron-scale Cu Traces against Thermal Oxidative Stress
5. High Frequency Characteristics of Glass Interposer
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