Die Edge Crack Propagation Modeling for Risk Assessment of Advanced Technology Nodes
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/8415930/8429093/08429853.pdf?arnumber=8429853
Cited by 9 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
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4. Minimizing die fracture in 3DIC die integration;Journal of Micro/Nanopatterning, Materials, and Metrology;2024-01-02
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