Modeling, design and demonstration of ultra-short and ultra-fine pitch metastable Cu-Sn interconnections with high-throughput SLID assembly-Reference-Cited by-同舟云学术

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Modeling, design and demonstration of ultra-short and ultra-fine pitch metastable Cu-Sn interconnections with high-throughput SLID assembly

Published:2015-05 Issue: Volume: Page:
ISSN:
Container-title:2015 IEEE 65th Electronic Components and Technology Conference (ECTC)
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Author:

Huang Ting-Chia,Smet Vanessa,Kawamoto Satomi,Sundaram Venky,Raj P. Markondeya,Tummala Rao R.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/7133058/7159553/07159777.pdf?arnumber=7159777

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Transient-Liquid-Phase Bonding of Granulated Cu–Sn Bumps With a 4-μm Fine Pitch;IEEE Transactions on Electron Devices;2023-02

2. Bubble formation and growth during Transient Liquid Phase Bonding in Cu/SnAg system for microelectronic packaging;Journal of Materials Science: Materials in Electronics;2021-12-02

3. Low-Temperature Cu-Cu Bonding Process Based on the Sn-Cu Multilayer and Self-Propagating Reaction Joining;Journal of Electronic Materials;2018-12-07

4. Intermetallic Bonding for High-Temperature Microelectronics and Microsystems: Solid-Liquid Interdiffusion Bonding;Intermetallic Compounds - Formation and Applications;2018-05-30

5. Detection of Liquefaction by DSC for Cu-Sn TLP Bonding;2018 IEEE 68th Electronic Components and Technology Conference (ECTC);2018-05

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