Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference32 articles.
1. S.W. Yoon, M.D. Glover, H.A. Mantooth, K. Shiozaki, Reliable and repeatable bonding technology for high temperature automotive power modules for electrified vehicles. J. Micromech. Microeng. 23(1), 015017 (2012). https://doi.org/10.1088/0960-1317/23/1/015017
2. K.E. Aasmundtveit, T.A. Tollefsen, T.-T. Luu, A. Duan, K. Wang, N. Hoivik, Solid–liquid interdiffusion (SLID) bonding—intermetallic bonding for high temperature applications, in 2013 European Microelectronics Packaging Conference (EMPC) (2013), pp. 1–6
3. N. Heuck, K. Guth, M. Thoben, A. Mueller, N. Oeschler, L. Boewer, R. Speckels, S. Krasel, A. Ciliox, Aging of new interconnect-technologies of power-modules during power-cycling, in CIPS 2014 8th International Conference on Integrated Power Electronics Systems (2014), pp. 1–6
4. T.-C. Huang, V. Smet, S. Kawamoto, V. Sundaram, P.M. Raj, R.R. Tummala, Modeling, design and demonstration of ultra-short and ultra-fine pitch metastable Cu–Sn interconnections with high-throughput SLID assembly, in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC). (2015), pp. 1377–1384. https://doi.org/10.1109/ECTC.2015.7159777
5. H. Huebner, S. Penka, B. Barchmann, M. Eigner, W. Gruber, M. Nobis, S. Janka, G. Kristen, M. Schneegans, Microcontacts with sub-30 μm pitch for 3D chip-on-chip integration. Microelectron. Eng. 83(11), 2155–2162 (2006). https://doi.org/10.1016/j.mee.200-6.09.026
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