In Situ Study the Grooving Effect Induced by Ag Particles on Rapid Growth of Cu6Sn5 Grain at Sn-xAg/Cu Soldering Interface during the Heat Preservation Stage-Reference-Cited by-同舟云学术

In Situ Study the Grooving Effect Induced by Ag Particles on Rapid Growth of Cu6Sn5 Grain at Sn-xAg/Cu Soldering Interface during the Heat Preservation Stage

Published:2023-08-11 Issue:8 Volume:13 Page:1445
ISSN:2075-4701
Container-title:Metals
language:en
Short-container-title:Metals

Author:

Guo Bingfeng¹,Ma Haitao²,Kunwar Anil³^ORCID,Wang Rongzhi¹,Zheng Han¹

Affiliation:

1. Physics Science and Engineering Technology College, Yichun University, Yichun 336000, China

2. School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, China

3. Faculty of Mechanical Engineering, Silesian University of Technology, Konarskiego 18A, 44-100 Gliwice, Poland

Abstract

Synchrotron radiation X-ray imaging technique was applied for in situ observation of Cu6Sn5 intermetallic compounds (IMC) growth in Sn/Cu and Sn-3.5Ag/Cu joints under isothermal temperature conditions of 250/300/350 °C and time duration of 1.5 h. The IMC in Sn-Ag solder was characterized by the formation of grooves during the interfacial reaction, and this can be attributed to the Ag content. Kinetically, the growth rate constants for the height of Cu6Sn5 were observed to increase with temperatures and the presence of Ag in solder. As compared to pure Sn solders, the Sn-3.5Ag solders were observed with interfacial IMC of greater height, smaller base width, and lowered aspect ratio.

Funder

Youth Natural Science Foundation Project of Jiangxi Provincial Department of Science and Technology

Student Innovation and Entrepreneurship Training Program of Yichun University

Publisher

MDPI AG

Subject

General Materials Science,Metals and Alloys

Link

https://www.mdpi.com/2075-4701/13/8/1445/pdf

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