In-situ study on growth behavior of Ag3Sn in Sn–3.5Ag/Cu soldering reaction by synchrotron radiation real-time imaging technology
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference29 articles.
1. Lead-free Solders in Microelectronics
2. Effect of soldering condition on formation of intermetallic phases developed between Sn–0.3Ag–0.7Cu low-silver lead-free solder and Cu substrate
3. Interfacial reactions and mechanical properties between Sn–4.0Ag–0.5Cu and Sn–4.0Ag–0.5Cu–0.05Ni–0.01Ge lead-free solders with the Au/Ni/Cu substrate
4. Interface reaction between SnAgCu/SnAgCuCe solders and Cu substrate subjected to thermal cycling and isothermal aging
5. Formation of bulk Ag3Sn intermetallic compounds in Sn-Ag lead-free solders in solidification
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1. Precipitation processes and phase interface structure of Ag3Sn during solidification of SnAg3Cu0.5/Cu solder joint;Vacuum;2024-01
2. In Situ Study the Grooving Effect Induced by Ag Particles on Rapid Growth of Cu6Sn5 Grain at Sn-xAg/Cu Soldering Interface during the Heat Preservation Stage;Metals;2023-08-11
3. Proposal of intense pulsed light soldering process for improving the drop impact reliability of Sn–3.0Ag–0.5Cu ball grid array package;Journal of Manufacturing Processes;2023-07
4. Nucleation and growth of Ag3Sn in Sn-Ag and Sn-Ag-Cu solder alloys;Acta Materialia;2023-05
5. Microstructures and mechanical properties of ENIG/Sn-3.5Ag/ENIG joints formed by ultrasonic-assisted solder bonding;Journal of Materials Research and Technology;2023-05
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