Author:
Jen-Chieh Liu ,Chung-Wei Hsu ,I-Ting Wang ,Tuo-Hung Hou
Funder
Ministry of Science and Technology, Taiwan, through the National Chiao Tung University–University of California at Berkeley within the International Research-Intensive Center of Excellence Program
Winbond Electronics
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials
Cited by
17 articles.
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