Author:
Kerber Andreas,Wan Xinggong,Liu Yang,Nigam Tanya
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials
Cited by
10 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Ring Oscillator Aging Characterization in Conventional CMOS Technologies;2023 37th Symposium on Microelectronics Technology and Devices (SBMicro);2023-08-28
2. Improving the Tamper-Aware Odometer Concept by Enhancing Dynamic Stress Operation;2023 IEEE International Reliability Physics Symposium (IRPS);2023-03
3. Reliability Study of 14 nm Scan Chains and Its Application to Hardware Security;2022 IEEE International Test Conference (ITC);2022-09
4. IC package related stress effects on the characteristics of ring oscillator circuits;2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2021-04-19
5. Reliability Characterization of Ring Oscillator Circuits for Advanced CMOS Technologies;IEEE Transactions on Device and Materials Reliability;2020-06