Author:
Ackaert Jan,Vanderstraeten Daniel,Vandevelde Bart
Cited by
5 articles.
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1. Study of Nitride Crack Reduction For Electronic Power Devices;2023 IEEE CPMT Symposium Japan (ICSJ);2023-11-15
2. Power Semiconductor Die Passivation Layer Stress Mechanism Investigation and optimization by Numerical Analysis;2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2023-04-17
3. Thermo-mechanical Characterization and Stress Simulation of Epoxy Molding Compound for a High-Power Package with Silicon Nitride Passivation Layer;2022 IEEE 24th Electronics Packaging Technology Conference (EPTC);2022-12-07
4. Numerical Analysis on Power Semiconductor Die Passivation Layer Stack Structure Behavior;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10
5. Design Optimization for Passivation Crack Improvement in Power Devices;2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2022-04-25