Power Semiconductor Die Passivation Layer Stress Mechanism Investigation and optimization by Numerical Analysis
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Published:2023-04-17
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Container-title:2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
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Author:
Zhou Zhou1,
Fan Haibo1,
Brown Adam2
Affiliation:
1. Nexperia,Hong Kong
2. Nexperia,UK