Author:
Chen Chun-Pei,Chen Yaxiong,Subbarayan Ganesh,Lin Hung-Yun,Gurrum Siva
Cited by
4 articles.
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1. Power Semiconductor Die Passivation Layer Stress Mechanism Investigation and optimization by Numerical Analysis;2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2023-04-17
2. Numerical Analysis on Power Semiconductor Die Passivation Layer Stack Structure Behavior;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10
3. Non-Intrusive Two-Way Coupling for Multiscale Analysis of Electronic Packages;2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm);2022-05-31
4. A Computational Strategy for Code- and Mesh-Agnostic Nonlinear Global–Local Analysis;IEEE Transactions on Components, Packaging and Manufacturing Technology;2022-05