Author:
Mirza Fahad,Khor E E Jan,Lee Fook Hong,Premachandran C S,Yi Wanbing,Tan Juan Boon,Graas Carole,Justison Patrick
Cited by
2 articles.
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1. Power Semiconductor Die Passivation Layer Stress Mechanism Investigation and optimization by Numerical Analysis;2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2023-04-17
2. Numerical Analysis on Power Semiconductor Die Passivation Layer Stack Structure Behavior;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10