Experimental method to thermally deembed pads from R/sub TH/ measurements-Reference-Cited by-同舟云学术

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Experimental method to thermally deembed pads from R/sub TH/ measurements

Published:2006-10 Issue:10 Volume:53 Page:2540-2544
ISSN:0018-9383
Container-title:IEEE Transactions on Electron Devices
language:
Short-container-title:IEEE Trans. Electron Devices

Author:

Li J.C.,Hitko D.A.,Sokolich M.,Asbeck P.M.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx5/16/35982/01705106.pdf?arnumber=1705106

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. BEOL Thermal Resistance Extraction in SiGe HBTs;IEEE Transactions on Electron Devices;2022-12

2. Methods for Extracting the Temperature- and Power-Dependent Thermal Resistance for SiGe and III-V HBTs From DC Measurements: A Review and Comparison Across Technologies;IEEE Transactions on Electron Devices;2022-08

3. Extraction of VBIC model parameters for InGaAsSb DHBTs;Microelectronics Reliability;2010-03

4. 100 GHz+ Gain-Bandwidth Differential Amplifiers in a Wafer Scale Heterogeneously Integrated Technology Using 250 nm InP DHBTs and 130 nm CMOS;IEEE Journal of Solid-State Circuits;2009-10

5. 40 ns pulsed I/V setup and measurement method applied to InP HBT characterisation;Electronics Letters;2009

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