Copper wire degradation under high temperature and high humidity without molding compound-Reference-Cited by-同舟云学术

Copper wire degradation under high temperature and high humidity without molding compound

Published:2021-12-07 Issue: Volume: Page:
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Container-title:2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
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Author:

Lim Michael Joo Zhong,Goroll Michael,Loh Hai Guan,Chen Zhong,Tan Chuan Seng

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9663571/9663865/09663891.pdf?arnumber=9663891

Reference15 articles.

1. Over-acceleration of corrosion mechanisms during reliability testing: A method to relate biased HAST tests and application conditions for Cu wire products

2. A study of the effectiveness of wire bond process parameters on AlCu IMC distributions and the correlation between bonded ball adhesions and IMC coverage;chen;IPFA,2018

3. Copper wire in automotive: Key challenges and robust validation

4. Nickel–palladium bond pads for copper wire bonding

5. Bonding Metallurgies

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3. Copper wire degradation under the effect of different humidity levels;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

4. A Technology for Bonding Cu Wires with Cu Pads: Structure and Electrical Fatigue Mechanism of Fine Micro-alloyed Cu Wires;Journal of Electronic Materials;2023-04-13