Author:
Chauhan Preeti S.,Choubey Anupam,Zhong ZhaoWei,Pecht Michael G.
Reference57 articles.
1. T. K. Lee, C. D. Breach, and W. L. Chong, “Comparsion of Au/Al and Cu/Al in wirebonding assembly and reliability,” in Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2011 6th International, 2011, pp. 234–237.
2. L. Hung, Y. Lin, S. Chen, Y. Wang, and C. S. Hsiao, “The characterization of intermetallic growth in copper and gold ball bonded on thicker aluminum,” in Electronic Packaging Technology, 2006. ICEPT '06. 7th International Conference on, 2006, pp. 1–6.
3. F. W. Wulff, C. D. Breach, D. Stephan, Saraswati, and K. J. Dittmer, “Characterisation of intermetallic growth in copper and gold ball bonds on aluminium metallization,” in Electronics Packaging Technology Conference, 2004. EPTC 2004. Proceedings of 6th, 2004, pp. 348–353.
4. H. Clauberg, P. Backus, and B. Chylak, “Nickel-palladium bond pads for copper wire bonding,” Microelectronics Reliability, vol. 51, pp. 75–80, Jan 2011.
5. L. England and T. Jiang, “Reliability of Cu wire bonding to Al metallization,” in Electronic Components and Technology Conference, 2007. ECTC '07. Proceedings. 57th, 2007, pp. 1604–1613.
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