Multiphysics Effect of Temperature and Humidity on Copper Wire Bond Degradation via Enthalpy-Based Water-Vapor Energy-Reference-Cited by-同舟云学术

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Multiphysics Effect of Temperature and Humidity on Copper Wire Bond Degradation via Enthalpy-Based Water-Vapor Energy

Published:2024-05 Issue:5 Volume:14 Page:945-950
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Lim Michael Joo Zhong¹^ORCID,Loh Hai Guan²,Goroll Michael³^ORCID,Chen Zhong⁴^ORCID,Tan Chuan Seng¹^ORCID

Affiliation:

1. School of Electrical and Electronic Engineering, Nanyang Technological University, Jurong West, Singapore

2. Reliability and Qualification, Infineon Technologies Asia Pacific, 8 Kallang Sector, Singapore

3. Reliability and Qualification, Infineon Technologies AG, Dresden, Germany

4. School of Material Science Engineering, Nanyang Technological University, Jurong West, Singapore

Funder

Industrial Postgraduate Program

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Link

http://xplorestaging.ieee.org/ielx7/5503870/10538069/10496143.pdf?arnumber=10496143

Reference18 articles.

1. Copper wire degradation under the effect of different humidity levels

2. Comprehensive Model for Humidity Testing Correlation

3. Reliability of Power Devices with Copper Wire Bond

4. Chlorine effect on copper bonding wire reliability

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