Reliability of Power Devices with Copper Wire Bond-Reference-Cited by-同舟云学术

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Reliability of Power Devices with Copper Wire Bond

Published:2022-07-18 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
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Author:

Pinili Ton¹,Ramos Manny¹,Manalo Ginbert¹,Brizar Guy²,Matthijs Koen²,Colle Frederik²,DeGreve Johan²,Kocourek Petr³,Cowell Bill⁴,Jensen John⁴,McGlone John⁴,Hose Sallie⁴,Gambino Jeff⁴

Affiliation:

1. Carmona,Philippines

2. Oudenaarde,Belgium

3. Roznov,Czech Republic

4. Gresham,OR,USA

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9915553/9915704/09915763.pdf?arnumber=9915763

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Multiphysics Effect of Temperature and Humidity on Copper Wire Bond Degradation via Enthalpy-Based Water-Vapor Energy;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-05

2. Effect of Scribe Line Metal Layout on Wafer Saw Top Edge Chipping for Silicon Power Devices;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05

3. Copper wire degradation under the effect of different humidity levels;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

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