Chip Last Fanout Chip on Substrate (FOCoS) Solution for Chiplets Integration-Reference-Cited by-同舟云学术

Chip Last Fanout Chip on Substrate (FOCoS) Solution for Chiplets Integration

Published:2022-05 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
language:
Short-container-title:

Author:

Lee Teck-Chong¹,Yang Shu-Han²,Wu Hsin-Yi²,Lin You-Jun¹

Affiliation:

1. Advanced Semiconductor Engineering Inc.,Corporate R&D/ Advanced Wafer Interconnect,Kaohsiung,Taiwan

2. Advanced Semiconductor Engineering Inc.,Corporate R&D/ Div. of New Panel-Level Packaging,Kaohsiung,Taiwan

Publisher

IEEE

Link

Reference5 articles.

3. Advanced HDFO Packaging Solutions for Chiplets Integration in HPC Application;cao;IEEE Electronic Components and Technology Conference (ECTC),2021

Cited by 17 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Reliability and Chiplets;IEEE Reliability Magazine;2024-06

2. Innovative Two-Phase Immersion Cooling Solutions for high-power Advanced Packages;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

3. Chiplet Communications (Bridges);Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology;2024

4. Fan-Out Technology;Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology;2024

5. Thermal Fatigue Analysis of Solder Balls in Chip-last Fan-out Chip Package;2023 International Conference on Internet of Things, Robotics and Distributed Computing (ICIRDC);2023-12-29