A Comparative Study of a Fan Out Packaged Product: Chip First and Chip Last-Reference-Cited by-同舟云学术

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A Comparative Study of a Fan Out Packaged Product: Chip First and Chip Last

Published:2016-05 Issue: Volume: Page:
ISSN:
Container-title:2016 IEEE 66th Electronic Components and Technology Conference (ECTC)
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Author:

Chen Scott,Wang Simon,Hunt John,Chen William,Liang Leander,Kao Golden,Peng Abner

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/7542794/7545393/07545619.pdf?arnumber=7545619

Cited by 17 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Semiconductor Package Design Flow and Platform Applied on Fan-out Chip on Substrate;2023 International Conference on Electronics Packaging (ICEP);2023-04-19

2. A Study on Alternative Substrate for FCBGA;2022 IEEE CPMT Symposium Japan (ICSJ);2022-11-09

3. Chip Last Fanout Chip on Substrate (FOCoS) Solution for Chiplets Integration;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05

4. A Versatile SoC/SiP Sensor Interface for Industrial Applications: Implementation Challenges;IEEE Access;2022

5. Hybrid RDL Design in Fan-out Package;2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC);2021-12-07

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