Fan-Out Panel Level Package with Fine Pitch Pattern-Reference-Cited by-同舟云学术

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Fan-Out Panel Level Package with Fine Pitch Pattern

Published:2018-05 Issue: Volume: Page:
ISSN:
Container-title:2018 IEEE 68th Electronic Components and Technology Conference (ECTC)
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Author:

Kim Jinyoung,Choi Ikjun,Park JunHyeong,Lee Jae-Ean,Jeong TaeSung,Byun Jungsoo,Ko YoungGwan,Hur Kangheon,Kim Dae-Woo,Oh Kyung Suk

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/8415930/8429093/08429529.pdf?arnumber=8429529

Cited by 45 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Laser micro drilling of around 3 microns into Ajinomoto Build-up Film;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

2. A Review of Polymer Dielectrics for Redistribution Layers in Interposers and Package Substrates;Polymers;2023-09-26

3. Warpage Analysis and Optimization of Fan-Out Panel-Level Packaging in Hygrothermal Environment;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08

4. Effect of Ceramic Filler in Epoxy Mold Compound on Thermomechanical Property of FOWLP;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

5. Electroplating Uniformity Enhancement for High Performance Fan-Out Panel Level Packaging;2023 International Conference on Electronics Packaging (ICEP);2023-04-19

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