High Fluorescence Photosensitive Materials for AOI Inspection of Fan-Out Panel Level Package-Reference-Cited by-同舟云学术

High Fluorescence Photosensitive Materials for AOI Inspection of Fan-Out Panel Level Package

Published:2022-05 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
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Author:

Kim Kiseok¹,Chae Seunghun²,Kim Jinyoung¹,Shim Jihye¹,Yoon Okseon¹,Kim Sooryeon¹

Affiliation:

1. Samsung Electronics Co., Ltd,Material Technology Team, Test & System Package,Cheonan-si Chungcheongnam-do,Korea

2. Samsung Electronics Co., Ltd,Process Development Team, Test & System Package,Cheonan-si Chungcheongnam-do,Korea

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816721.pdf?arnumber=9816721

Reference8 articles.

1. Adaptie Short Technology to Address Severe Lithography Challenges For Advanced FOPLP;chang;2022 IEEE 70th Electronic Component and Technology Conference (ECTC),0

2. Warpage simulation and experimental verification for 320 mm × 320 mm panel level fan-out packaging based on die-first process

3. Fan-Out Panel Level Package with Fine Pitch Pattern

4. FOPLP at the verge of volume production;bae;IWLPC 2017,2017

5. Warpage Sinulation on a Typical Fan-Out Panel Level Package(FOPLP) Process with Glass Carrier;lo;2019 14th International Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT),0

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