Optimization of 2.5D Organic Interposer Channel for Die and Chiplets
Author:
Affiliation:
1. Applied Materials Inc.,USA
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816489.pdf?arnumber=9816489
Reference11 articles.
1. Embedded Multi-die Interconnect Bridge (EMIB) -- A High Density, High Bandwidth Packaging Interconnect
2. Signal and power integrity (SI/PI) analysis of heterogeneous integration using embedded multi-die interconnect bridge (EMIB) technology for high bandwidth memory (HBM)
3. Design optimization of high bandwidth memory (HBM) interposer considering signal integrity
4. Electrical performance of high bandwidth memory (HBM) interposer channel in terabyte/s bandwidth graphics module
Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Modeling and Analysis of Heterogeneously Integrated Chiplet-to-Chiplet Communication Link in 2.5D Advanced Packaging;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
2. Signal Integrity Design and Analysis of Redistribution Layer Interposer Channel with Diagonal Meshed Ground in Memory Interface of High Bandwidth Memory;2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS);2023-10-15
3. Thermomechanical Challenges of 2.5-D Packaging: A Review of Warpage and Interconnect Reliability;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-10
4. Metaconductor-Based High Signal Integrity Interconnects for 112 Gbps SerDes Interface with Channel Analysis;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3