In-situ monitoring of thermo-mechanical induced stresses in electronic control unit – from the assembly to use in the field-Reference-Cited by-同舟云学术

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In-situ monitoring of thermo-mechanical induced stresses in electronic control unit – from the assembly to use in the field

Published:2022-05 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
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Author:

Gromala Przemyslaw¹,Riegel Daniel²,Konstantin Georg³,Kabakchiev Alexander⁴

Affiliation:

1. Robert Bosch GmbH,Automotive Electronics,Reutlingen,72764

2. Robert Bosch GmbH,Nuernberg,90441

3. Robert Bosch GmbH, Chassis Systems Control,Abstatt,74232

4. Robert Bosch GmbH, Corporate Research,Renningen,71272

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816462.pdf?arnumber=9816462

Reference12 articles.

1. IEEE Guide for Selecting and Using Reliability Predictions Based on IEEE 1413 tm,2010

2. IEEE Standard Framework for the Reliability Prediction of Hardware;IEEE Std 1413,2009

3. Engineering piezoresistivity using biaxially strained silicon

4. First-principles study of electronic properties of biaxially strained silicon: Effects on charge carrier mobility

5. Simulation Driven Design of Novel Integrated Circuits - Part 4: Method of Validation of Coupled Thermal and Thermo-mechanical Simulation

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Monitoring of wafer thinning induced in-die mechanical stress with embedded sensors for heterogeneous integration;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

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