Monitoring of wafer thinning induced in-die mechanical stress with embedded sensors for heterogeneous integration-Reference-Cited by-同舟云学术

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Monitoring of wafer thinning induced in-die mechanical stress with embedded sensors for heterogeneous integration

Published:2024-05-28 Issue: Volume: Page:996-1002
ISSN:
Container-title:2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
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Author:

Piadena Alberto¹,Quarantelli Michele²,Brozek Tomasz²,Saxena Sharad¹,Hess Christopher³,Weiland Larg¹,Vallishayee Rakesh¹,Yu Yuan¹,Strojwas Andrzej¹

Affiliation:

1. PDF Solutions Inc.,Santa Clara (CA),USA

2. PDF Solutions Inc.,Desenzano del Garda (BS),Italy

3. PDF Solutions Inc.,Dallas (TX),USA

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx8/10564841/10564831/10565277.pdf?arnumber=10565277

Reference8 articles.

1. A Heterogeneous and Programmable Compute-In-Memory Accelerator Architecture for Analog-AI Using Dense 2-D Mesh

2. Die-package stress interaction impact on transistor performance

3. In-situ monitoring of thermo-mechanical induced stresses in electronic control unit – from the assembly to use in the field

4. Tracking in-die mechanical stress through silicon embedded sensors for advanced packaging applications

5. In-Product BTI Aging Sensor for Reliability Screening and Early Detection of Material at Risk

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