Tracking in-die mechanical stress through silicon embedded sensors for advanced packaging applications-Reference-Cited by-同舟云学术

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Tracking in-die mechanical stress through silicon embedded sensors for advanced packaging applications

Published:2022-05 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
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Author:

Saxena Sharad¹,Hess Christopher¹,Quarantelli Michele¹,Piadena Alberto¹,Weiland Larg¹,Vallishayee Rakesh¹,Yu Yuan¹,Ciplickas Dennis¹,Brozek Tomasz¹,Strojwas Andrzej¹

Affiliation:

1. PDF Solutions Inc.,Santa Clara,CA,USA,95050

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816606.pdf?arnumber=9816606

Reference7 articles.

1. Aging of the Molding Compound Identification using Piezoresistive Silicon Based Stress Sensor

2. $In\ Situ$ Failure Detection of Electronic Control Units Using Piezoresistive Stress Sensor

3. Package induced stress impact on transistor performance for ultra-thin SoC

4. Single Chip and Multi-Chip Integartion;Heterogeneous Integration Roadmap,2021

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Monitoring of wafer thinning induced in-die mechanical stress with embedded sensors for heterogeneous integration;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

2. In-Product BTI Aging Sensor for Reliability Screening and Early Detection of Material at Risk;2023 IEEE International Reliability Physics Symposium (IRPS);2023-03

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