Reliability Assessment of Ultra-low-K dielectric Material and Demonstration in Advanced Interposers-Reference-Cited by-同舟云学术

Reliability Assessment of Ultra-low-K dielectric Material and Demonstration in Advanced Interposers

Published:2022-05 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
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Author:

Bhaskar Pragna¹,Blancher Christopher¹,Kathaperumal Mohan²,Swaminathan Madhavan³,Losego Mark D.¹

Affiliation:

1. Georgia Institute of Technology,3D Systems Packaging Research Center, School of Material Science and Engineering,Atlanta,USA

2. Georgia Institute of Technology,3D Systems Packaging Research Center, School of Electrical and Computer Engineering,Atlanta,USA

3. Georgia Institute of Technology,3D Systems Packaging Research Center, School of Electrical and Computer Engineering, School of Material Science and Engineering,Atlanta,USA

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816491.pdf?arnumber=9816491

Reference9 articles.

1. Evaluation of Fine-Pitch Routing Capabilities of Advanced Dielectric Materials for High Speed Panel-RDL in 2.5D Interposer and Fan-Out Packages

2. Fabrication and reliability demonstration of 5μm redistribution layer using low-stress dielectric dry film

3. Vapor phase infiltration of aluminum oxide into benzocyclobutene-based polymer dielectrics to increase adhesion strength to thin film metal interconnects

4. Heterogeneous Integration for AI applications: Status and Future Needs;ravichandran;Chip Scale Review,0

5. Demonstration of 20 um I/O Pitch RDL Using a Novel, Ultra-Thin Dry Film Photosensitive Dielectric for Panel-Based Glass Interposers

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