Effect of Surface Roughness of Polymer Dielectric Materials on Resolution of Fine Line Features-Reference-Cited by-同舟云学术

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Effect of Surface Roughness of Polymer Dielectric Materials on Resolution of Fine Line Features

Published:2023-05 Issue: Volume: Page:
ISSN:
Container-title:2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
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Author:

Bhaskar Pragna¹^ORCID,Kathaperumal Mohan²,Blancher Christopher¹,Losego Mark¹,Swaminathan Madhavan³

Affiliation:

1. School of Material Science and Engineering, Georgia Institute of Technology,3D Systems Packaging Research Center,Atlanta,USA

2. School of Electrical and Computer Engineering, Georgia Institute of Technology,3D Systems Packaging Research Center,Atlanta,USA

3. Georgia Institute of Technology,3D Systems Packaging Research Center,Atlanta,USA

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10195193/10195244/10195647.pdf?arnumber=10195647

Reference10 articles.

1. Performance modeling and broadband characterization of chip-to-chip interconnects with rough surfaces

2. Reflectivity and surface roughness of multilayer-coated substrate recovery layers for EUV lithographic optics

3. Reliability Assessment of Ultra-low-K dielectric Material and Demonstration in Advanced Interposers

4. Effect of Ultra-Fine Pitch RDL Process Variations on the Electrical Performance of 2.5D Glass Interposers up to 110 GHz

5. Metallization Technologies on a Smooth Resin Surface for the Next Generation of Flip Chip Packaging

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1. Strong Adhesion of Electroless Plated Copper by Optimizing Lamination Temperature of Epoxy Composite Film for Advanced Chip Packaging Substrates;Advanced Engineering Materials;2024-07-11

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