Antenna-Integrated, Die-Embedded Glass Package for 6G Wireless Applications-Reference-Cited by-同舟云学术

Antenna-Integrated, Die-Embedded Glass Package for 6G Wireless Applications

Published:2022-05 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
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Author:

Jia Xiaofan¹,Li Xingchen¹,Moon Kyoung-sik¹,Kim Joon Woo¹,Huang Kai-Qi¹,Jordan Matthew B.²,Swaminathan Madhavan¹

Affiliation:

1. Georgia Institute of Technology,3D Systems Packaging Research Center,Atlanta,USA

2. Sandia National Laboratories,Albuquerque,USA

Funder

U.S. Department of Energy

National Science Foundation

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816665.pdf?arnumber=9816665

Reference10 articles.

1. Large-body-sized Glass-based Active Interposer for High-Performance Computing

2. A 200mw d-band power amplifier with 17.8% pae in 250-nm inp hbt technology;ahmed;2020 15th European Microwave Integrated Circuits Conference (EuMIC),2021

3. “zero-undercut” semi-additive copper patterning - a breakthrough for ultrafine-line RDL lithographic structures and precision RF thinfilm passives

4. Characterization of ABF/Glass/ABF Substrates for mmWave Applications

5. Glass-Based IC-Embedded Antenna-Integrated Packages for 28-GHz High-Speed Data Communications

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