Implementation of New Robustness Assessment Methodology for Crack Stop Constructions
Author:
Affiliation:
1. Infineon Technologies AG,Regensburg,Germany
2. Infineon Technologies AG,Munich,Germany
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10195193/10195244/10195348.pdf?arnumber=10195348
Reference3 articles.
1. Innovative Design of Crackstop Wall for 14nm Technology Node and Beyond
2. Die Edge Crack Propagation Modeling for Risk Assessmen of Advanced Technology Nodes;xu;Proc 68th IEEE Electronic Components and Technology Conference,0
3. Determination of Fracture Properties of Thin Dielectric Films by Nanoindentation;ananiev;21st International Conference on Thermal Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems support of TF3 and also TF2 in IPCEI,0
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1. Limits for Dicing Speed Based on Crack Stop Constructions with Different Levels of Robustness;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
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