Innovative Fan-Out Embedded Bridge Structure for Co-Packaged Optics
Author:
Affiliation:
1. SPIL,Taichung,Taiwan
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10195193/10195244/10195689.pdf?arnumber=10195689
Reference8 articles.
1. Demonstration of Fan-out Silicon Photonics Module for Next Generation Co-Packaged Optics (CPO) Application
2. Attachment of Alignment Fibre on Interposer for Fibre Optic Array Assembly;ching wai;Electronic Packaging Technology Conf (EPTC,0
3. Advanced 2.5D and 3D packaging technologies for next generation Silicon Photonics in high performance networking applications
4. Yole development;Silicon Photonics,2021
5. An EIC on PIC packaging solution for photonic engine of 800G data rate and beyond
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2. A surface-mount photonic package with a photonic-wire-bonded glass interposer as a hybrid integration platform for co-packaged optics;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
3. High Bandwidth and Energy Efficient Electrical-Optical System Integration Using COUPE Technology;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
4. Fan-Out Embedded Bridge Structure for CoPackaged Optics Characterization and Evaluation;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
5. Co-packaged Optics;Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology;2024
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