Development of all-photonics-function embedded package substrate using 2.3D RDL interposer for co-packaged optics-Reference-Cited by-同舟云学术

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Development of all-photonics-function embedded package substrate using 2.3D RDL interposer for co-packaged optics

Published:2024-05-28 Issue: Volume: Page:96-100
ISSN:
Container-title:2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
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Author:

Noriki Akihiro¹,Uemura Hirotaka²,Kuwatsuka Haruhiko¹,Matsui Naoki²,Motoii Reona²,Maeda Dan²,Sugita Tomoya²,Nakamura Fumi¹,Suda Satoshi¹,Kurosu Takayuki¹,Amano Takeru¹

Affiliation:

1. Science and Technology (AIST),National Institute of Advanced Industrial,Tsukuba,Japan

2. Kyocera Corporation,Yokohama,Japan

Funder

Technology Development

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx8/10564841/10564831/10565245.pdf?arnumber=10565245

Reference12 articles.

1. Co‐packaged datacenter optics: Opportunities and challenges

2. Solving the Escape Density Problem: Making connections count with SCIP

3. Co-packaged Optics on Glass Substrates for 102.4 Tb/s Data Center Switches

4. Innovative Fan-Out Embedded Bridge Structure for Co-Packaged Optics

5. A Heterogeneously Integrated Wafer-level Processed Co-Packaged Optical Engine for Hyper-scale Data Centres

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