Advanced 2.5D and 3D packaging technologies for next generation Silicon Photonics in high performance networking applications
Author:
Affiliation:
1. Cisco Systems, Inc.,Technology & Quality,San Jose,US
2. Cisco Systems, Inc.,Client Optics Group,Carlsbad,US
3. Cisco Systems, Inc.,Technology & Quality,Allentown,US
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816374.pdf?arnumber=9816374
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1. Rapid growth of IP traffic is driving adoption of silicon photonics in data centers
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