Modeling and Characterization of Through-Silicon-Vias (TSVs) in Radio Frequency Regime in an Active Interposer Technology
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Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9151098/9159179/09159346.pdf?arnumber=9159346
Cited by 7 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Improved Signal Integrity at 64 Gbps in a 130-nm SiGe Optical Receiver With Through-Silicon Vias;2022 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS);2022-10-16
2. Advanced 2.5D and 3D packaging technologies for next generation Silicon Photonics in high performance networking applications;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05
3. Trends and Challenges in Advanced Packaging Development for Silicon Photonics Beyond 400Gbps in Hyperscale Data Center Networking Applications;2022 6th IEEE Electron Devices Technology & Manufacturing Conference (EDTM);2022-03-06
4. Signal Integrity in High Speed 3D IC Design- A Case Study;2021 IEEE Nordic Circuits and Systems Conference (NorCAS);2021-10-26
5. Assessment of through‐silicon‐vias with different configurations of ground vias and accounting for substrate losses;International Journal of RF and Microwave Computer-Aided Engineering;2021-07-17
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