Integrated Optical Interconnect Systems (iOIS) for Silicon Photonics Applications in HPC

Author:

Hsia Harry1,Tai S. P.1,Liu C. S.1,Tseng C. W.1,Lu S.W.1,Wu Yutung1,Chang C. C.1,Wu Jason1,Yee K. C.1,Wu C. Y.1,Tung C. H.1,Yu Douglas C.H.1

Affiliation:

1. TSMC

Publisher

IEEE

Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. High Bandwidth and Energy Efficient Electrical-Optical System Integration Using COUPE Technology;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

2. 3D Heterogeneous Integration with Sub-3μm Bond Pitch Chip-to-Wafer Hybrid Bonding;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

3. Co-packaged Optics;Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology;2024

4. Characterization of Differential TMV Vertical Interconnects to 50GHz with Double Side Measurement;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05

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