Monitoring of Cylindrical Plunge Grinding Process by Electromechanical Impedance-Reference-Cited by-同舟云学术

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Monitoring of Cylindrical Plunge Grinding Process by Electromechanical Impedance

Published:2022-06-15 Issue:12 Volume:22 Page:12314-12322
ISSN:1530-437X
Container-title:IEEE Sensors Journal
language:
Short-container-title:IEEE Sensors J.

Author:

Ferreira Fabio Isaac¹^ORCID,de Aguiar Paulo Roberto¹^ORCID,Silva Rosemar Batista da²^ORCID,Jackson Mark James³,Baptista Fabricio Guimaraes¹^ORCID,Bianchi Eduardo Carlos¹^ORCID

Affiliation:

1. Electrical Engineering Department and the Mechanical Engineering Department, School of Engineering, São Paulo State University (UNESP), Bauru, Brazil

2. School of Mechanical Engineering, Federal University of Uberlândia, Santa Mônica Campus, Uberlândia, Brazil

3. School of Integrated Studies, Kansas State University, Salina, KS, USA

Funder

Capes Foundation, Ministry of Education of Brazil

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Instrumentation

Link

http://xplorestaging.ieee.org/ielx7/7361/9795939/09766354.pdf?arnumber=9766354

Reference34 articles.

1. Surface integrity investigation including grinding burns using barkhausen noise (BNA)

2. Dynamic in-process characterization method based on acoustic emission for topographic assessment of conventional grinding wheels

3. An Experimental Study on the Effect of Temperature on Piezoelectric Sensors for Impedance-Based Structural Health Monitoring

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