An All-Silicon Process Platform for Wafer-Level Vacuum Packaged MEMS Devices-Reference-Cited by-同舟云学术

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An All-Silicon Process Platform for Wafer-Level Vacuum Packaged MEMS Devices

Published:2021-07-01 Issue:13 Volume:21 Page:13958-13964
ISSN:1530-437X
Container-title:IEEE Sensors Journal
language:
Short-container-title:IEEE Sensors J.

Author:

Torunbalci Mustafa Mert^ORCID,Gavcar Hasan Dogan,Yesil Ferhat,Alper Said Emre^ORCID,Akin Tayfun

Funder

State Planning Organization (DPT) of Turkey (currently Ministry of Development) with a project titled Industrial Micro- Electro-Mechanical Systems

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Instrumentation

Link

http://xplorestaging.ieee.org/ielx7/7361/9468716/09406983.pdf?arnumber=9406983

Cited by 12 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Large-stroke and high-precision coaxial integrated macro-micro composite actuator based on VCM and GMA;International Journal of Applied Electromagnetics and Mechanics;2024-08-09

2. Reliability of MEMS inertial devices in mechanical and thermal environments: A review;Heliyon;2024-03

3. Low-Temperature Wafer-Level Bonding with Cu-Sn-In Solid Liquid Interdiffusion for Microsystem Packaging;Microelectronic Engineering;2024-03

4. MEMS-based piezoresistive and capacitive microphones: A review on materials and methods;Materials Science in Semiconductor Processing;2024-01

5. Research on Packaging Reliability and Quality Factor Degradation Model for Wafer-Level Vacuum Sealing MEMS Gyroscopes;Micromachines;2023-10-20

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