FBG Head Size Influence on Localized On-Chip Thermal Measurement in IGBT Power Modules
Author:
Affiliation:
1. Department of Electrical and Electronic Engineering, The University of Manchester, Manchester, U.K.
2. Offshore Renewable Energy (ORE) Catapult, Newcastle upon Tyne, U.K.
Funder
Research Programme of the Electrical Infrastructure Research Hub in collaboration with the Offshore Renewable Energy Catapult
China Scholarship Council
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Instrumentation
Link
http://xplorestaging.ieee.org/ielx7/7361/9946942/09913823.pdf?arnumber=9913823
Reference19 articles.
1. Comparison of Junction Temperature Evaluations in a Power IGBT Module Using an IR Camera and Three Thermosensitive Electrical Parameters
2. Thermal characteristics analysis of an IGBT using a fiber Bragg grating
3. A fiber bragg grating sensing system for monitoring IGBT temperature distribution and thermal conduction state of upper surface silicone
4. Distributed Thermal Monitoring of Wind Turbine Power Electronic Modules Using FBG Sensing Technology
5. Direct on Chip Thermal Measurement in IGBT Modules Using FBG Technology—Sensing Head Interfacing
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