Direct on Chip Thermal Measurement in IGBT Modules Using FBG Technology—Sensing Head Interfacing-Reference-Cited by-同舟云学术

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Direct on Chip Thermal Measurement in IGBT Modules Using FBG Technology—Sensing Head Interfacing

Published:2022-01-15 Issue:2 Volume:22 Page:1309-1320
ISSN:1530-437X
Container-title:IEEE Sensors Journal
language:
Short-container-title:IEEE Sensors J.

Author:

Chen Shiying,Vilchis-Rodriguez Damian^ORCID,Djurovic Sinisa^ORCID,Barnes Mike^ORCID,Mckeever Paul^ORCID,Jia Chunjiang

Funder

UK Offshore Renewable Energy Catapult

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Instrumentation

Link

http://xplorestaging.ieee.org/ielx7/7361/9679458/09627981.pdf?arnumber=9627981

Cited by 9 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Fiber Bragg Grating Total Temperature Probes for High-Speed Airflow With High Recovery Factor;IEEE Sensors Journal;2023-11-15

2. Progress of fiber Bragg grating sensors in state perception of electrical equipment;Measurement;2023-11

3. Junction Temperature Estimation Technologies of IGBT Modules in Converter-Based Applications;IECON 2023- 49th Annual Conference of the IEEE Industrial Electronics Society;2023-10-16

4. Direct On-Chip IGBT Thermal Sensing Using Adhesive Bonded FBG Sensors;IEEE Sensors Journal;2023-10-01

5. Temperature Monitoring of Multi-Chip SiC MOSFET Modules: On-Chip RTDs vs. V_SD(T);2023 25th European Conference on Power Electronics and Applications (EPE'23 ECCE Europe);2023-09-04

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