A Nearly Interference-Free and Depth-Resolution-Configurable Time-of-Flight System Based on a Mega-Pixel Vertical Avalanche Photodiodes CMOS Image Sensor-Reference-Cited by-同舟云学术

A Nearly Interference-Free and Depth-Resolution-Configurable Time-of-Flight System Based on a Mega-Pixel Vertical Avalanche Photodiodes CMOS Image Sensor

Published:2022 Issue: Volume:3 Page:324-335
ISSN:2644-1225
Container-title:IEEE Open Journal of Circuits and Systems
language:
Short-container-title:IEEE Open J. Circuits Syst.

Author:

Yamada Shota¹^ORCID,Ishii Motonori¹,Kasuga Shigetaka¹,Takemoto Masato¹,Kitajima Hiromu¹,Okino Toru¹,Sakata Yusuke¹,Usuda Manabu¹,Nose Yugo¹,Koshida Hiroshi¹,Tamaru Masaki¹,Inoue Akito¹^ORCID,Sugiura Yuki¹,Saito Shigeru¹,Kunikyo Taiki¹,Yuasa Yusuke¹,Nakanishi Kentaro¹,Torazawa Naoki¹,Shirono Takashi¹,Kabe Tatsuya¹,Koyama Shinzo¹,Mori Mitsuyoshi¹,Hirose Yutaka¹^ORCID,Sawada Masayuki¹,Odagawa Akihiro¹,Tanaka Tsuyoshi¹

Affiliation:

1. Engineering Division, Panasonic Industry Company Ltd., Kadoma, Japan

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

General Medicine

Link

http://xplorestaging.ieee.org/ielx7/8784029/9684754/09966366.pdf?arnumber=9966366

Reference24 articles.

1. 5.7 A 256×256 40nm/90nm CMOS 3D-Stacked 120dB Dynamic-Range Reconfigurable Time-Resolved SPAD Imager

2. Megapixel time-gated SPAD image sensor for 2D and 3D imaging applications

3. 5.2 A 1200×900 6?m 450fps geiger-mode vertical avalanche photodiodes CMOS image sensor for a 250m time-of-flight ranging system using direct-indirect-mixed frame synthesis with configurable-depth-resolution down to 10cm;okino;Proc IEEE Int Solid-State Circuits Conf (ISSCC),2020

4. 7.3 A 189×600 Back-Illuminated Stacked SPAD Direct Time-of-Flight Depth Sensor for Automotive LiDAR Systems

5. A Hybrid Indirect ToF Image Sensor for Long-Range 3D Depth Measurement under High Ambient Light Conditions

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1. Robust Pixel Design Methodologies for a Vertical Avalanche Photodiode (VAPD)-Based CMOS Image Sensor;Sensors;2024-08-21