A Hybrid Indirect ToF Image Sensor for Long-Range 3D Depth Measurement under High Ambient Light Conditions-Reference-Cited by-同舟云学术

A Hybrid Indirect ToF Image Sensor for Long-Range 3D Depth Measurement under High Ambient Light Conditions

Published:2022-06-12 Issue: Volume: Page:
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Container-title:2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)
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Author:

Hatakeyama Kunihiro¹,Okubo Yu¹,Nakagome Tomohiro¹,Makino Masahiro²,Takashima Hiroshi²,Akutsu Takahiro³,Sawamoto Takehide³,Nagase Masanori³,Noguchi Tatsuo¹,Kawahito Shoji³

Affiliation:

1. Toppan Inc.,Tokyo,Japan

2. Toppan Technical Design Center Co., Ltd.,Tokyo,Japan

3. Brookman Technology, Inc.,Hamamatsu,Japan

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9830116/9830138/09830139.pdf?arnumber=9830139

Reference7 articles.

Cited by 8 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Motion-resistant three-wavelength spatial frequency domain imaging system with ambient light suppression using an 8-tap CMOS image sensor;Journal of Biomedical Optics;2024-01-18

2. A Low-Depth-Noise Indirect Time-of-Flight CMOS Image Sensor With Tap-Rotating Technique for Extended Range and Enhanced Imaging Quality;IEEE Solid-State Circuits Letters;2024

3. Ultra-High-Speed Charge-Domain Temporally Compressive CMOS Image Sensors;Coded Optical Imaging;2023-08-01

4. A Hybrid ToF Image Sensor for Long-Range 3D Depth Measurement Under High Ambient Light Conditions;IEEE Journal of Solid-State Circuits;2023-04

5. [Paper] A 2-Tap 4-Phase Indirect Time-of-Flight Ranging Method using Half-Pulse Modulation for Depth Precision Enhancement and Sub-Frame Operation for Motion Artifact Suppression;ITE Transactions on Media Technology and Applications;2023