Scaling Trends in NAND Flash
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/8601505/8614478/08614694.pdf?arnumber=8614694
Cited by 39 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Impact of Process Sequence and Device Architecture on Mechanical Stress and Electrical Properties of 3-D Nand Flash;IEEE Transactions on Electron Devices;2024-09
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