Advances, challenges and opportunities in 3D CMOS sequential integration-Reference-Cited by-同舟云学术

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Advances, challenges and opportunities in 3D CMOS sequential integration

Published:2011-12 Issue: Volume: Page:
ISSN:
Container-title:2011 International Electron Devices Meeting
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Author:

Batude P.,Vinet M.,Previtali B.,Tabone C.,Xu C.,Mazurier J.,Weber O.,Andrieu F.,Tosti L.,Brevard L.,Sklenard B.,Coudrain P.,Bobba S.,Ben Jamaa H.,Gaillardon P-E.,Pouydebasque A.,Thomas O.,Le Royer C.,Hartmann J.-M.,Sanchez L.,Baud L.,Carron V.,Clavelier L.,De Micheli G.,Deleonibus S.,Faynot O.,Poiroux T.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/6123666/6131464/06131506.pdf?arnumber=6131506

Cited by 58 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Heterogeneous monolithic 3D integration for hybrid vertical CMOS inverter using n-type IGTO TFT on p-type Si FET;Materials Science in Semiconductor Processing;2025-01

2. SILC and TDDB reliability of novel low thermal budget RMG gate stacks;2024 IEEE International Reliability Physics Symposium (IRPS);2024-04-14

3. Monolithic 3D Integration using BEOL FeFET: Reliability, Thermal Effects, and DNN Accuracy;2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM);2024-03-03

4. Thickness-Dependent Ferroelectricity in Freestanding Hf_0.5Zr_0.5O₂ Membranes;ACS Applied Electronic Materials;2024-02-23

5. Nanowire-Based Si-CMOS Devices;Springer Tracts in Electrical and Electronics Engineering;2024

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